Signal Integrity Challenges in Modern AI Computers: Package and PCB Materials

Name: Signal Integrity Challenges in Modern AI Computers: Package and PCB Materials
Start: 2026-11-05
End: 2026-11-05
Location: Engineering Center

Thursday, November 5 · 7:00 PM

Engineering Center, Boulder · Boulder, CO

Darren Hitchcock, senior business development manager, Panasonic will cover how how package and PCB material choices affect signal integrity…

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